quad flat package

The research in this thesis is supported by the National Natural Science Foundation Project. The structure and dimension parameters of Quad Flat no-lead package ( QFN) devices has been optimized and analyzed.

本文依托于国家自然科学基金项目微电子封装中的界面层裂失效和界面强度可靠性设计方法，对四方扁平无引脚封装（QFN）器件进行了结构尺寸参数优化和分析。

Specification of lead frames for plastic quad flat package

GB/T15876-1995塑料四面引线扁平封装引线框架规范

Dual in line lead frame quad flat package

双列直插式引线框架四列直插式扁平外壳

Extension arbor for Morse taper bush without tang quad flat package

无扁尾莫氏锥套接长杆四列直插式扁平外壳